SMT is Surface Mount Technology (Surface-mount Technology) , which is the most popular Technology and process in electronic assembly industry.
SMT features:
1.With high assembling density, small volume and light weight of electronic products, the volume and weight of SMT components are only about 1/10 of those of traditional cartridge components. Generally, after adopting SMT, the volume and weight of electronic products are reduced by 40% ~ 60% and 60% ~ 80% respectively.
2.High reliability, strong anti-vibration ability, low defect rate of solder joint.
3.Good high-frequency characteristics, reduce electromagnetic and radio-frequency interference.
4.It is easy to realize automation and improve production efficiency. reduce costs by 30% ~ 50% . Save material, energy, equipment, manpower, time, etc.
SMT features:
1.With high assembling density, small volume and light weight of electronic products, the volume and weight of SMT components are only about 1/10 of those of traditional cartridge components. Generally, after adopting SMT, the volume and weight of electronic products are reduced by 40% ~ 60% and 60% ~ 80% respectively.
2.High reliability, strong anti-vibration ability, low defect rate of solder joint.
3.Good high-frequency characteristics, reduce electromagnetic and radio-frequency interference.
4.It is easy to realize automation and improve production efficiency. reduce costs by 30% ~ 50% . Save material, energy, equipment, manpower, time, etc.
Why use SMT:
1.The pursuit of miniaturization of electronic products, the previously used plug-in components have been unable to shrink.
2.Electronic products function more complete, the use of integrated circuit (IC) has no perforated components, especially large-scale, high-integrated IC, had to use surface chip components.
3.Mass production, production automation, the factory should be low-cost high-volume, high-quality products to meet customer demand and strengthen market competitiveness.
4.The development of electronic component, the development of integrated circuits (ICS) , and the diverse applications of List of semiconductor materials.
1.The pursuit of miniaturization of electronic products, the previously used plug-in components have been unable to shrink.
2.Electronic products function more complete, the use of integrated circuit (IC) has no perforated components, especially large-scale, high-integrated IC, had to use surface chip components.
3.Mass production, production automation, the factory should be low-cost high-volume, high-quality products to meet customer demand and strengthen market competitiveness.
4.The development of electronic component, the development of integrated circuits (ICS) , and the diverse applications of List of semiconductor materials.
Experienced Management Team
Continuous improvement and continuous of optimization of production processes
Continuous improvement and continuous of optimization of production processes
